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The smear present in the throughholes after drilling is removed in a plasma reactor by plasma etching, during which the plasma is limited to the areas of the throughholes.
English (United States)
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Method of Removing Smear from Substrate Throughholes
The smear present in the throughholes after drilling is removed in a plasma
reactor by plasma etching, during which the plasma is limited to the areas of the
A flat substrate 1, for example, a printed circuit board containing a great
number of drilled throughholes 2, is located between and substantially parallel to
electrodes 3 and 4 of the reactor. Plasma 5 is generated in the gas atmosphere
between electrodes 3 and 4, the plasma parameters, such as gas pressure, field
strength, electrode spacing, being adjusted in such a manner that the distance
between substrate 1 and electrodes 3 and 4, respectively, is smaller than the
dimensions of the dark space. As a result, plasma 5 burns only in the areas of
throughholes 2, so that the etch effect is limited to throughholes 2 and the etch
attack on the main surfaces of substrate 1 is negligible.
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