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Method of Removing Smear from Substrate Throughholes

IP.com Disclosure Number: IPCOM000049375D
Original Publication Date: 1982-Apr-01
Included in the Prior Art Database: 2005-Feb-09

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Hinkel, H Kraus, G Kuenzel, U Schmid, G [+details]


The smear present in the throughholes after drilling is removed in a plasma reactor by plasma etching, during which the plasma is limited to the areas of the throughholes.