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Rectangular Bonding Pad and Spacing Pattern for Large Pad Area and Increased Pad Spacing Disclosure Number: IPCOM000049386D
Original Publication Date: 1982-Apr-01
Included in the Prior Art Database: 2005-Feb-09

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Related People

Fritz, RA [+details]


Bonding pads to which I/O pins are attached are made rectangular in shape and are arrayed on a circuit module with the long and short directions of the rectangles alternating. This arrangement gives the largest pad to pad spacing possible and still provides a large pad area for brazing the pins to the pads.