Browse Prior Art Database

Rectangular Bonding Pad and Spacing Pattern for Large Pad Area and Increased Pad Spacing

IP.com Disclosure Number: IPCOM000049386D
Original Publication Date: 1982-Apr-01
Included in the Prior Art Database: 2005-Feb-09

Publishing Venue

IBM

Related People

Authors:
Fritz, RA [+details]

Abstract

Bonding pads to which I/O pins are attached are made rectangular in shape and are arrayed on a circuit module with the long and short directions of the rectangles alternating. This arrangement gives the largest pad to pad spacing possible and still provides a large pad area for brazing the pins to the pads.