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Laser Enhanced Plating/ Etching Disclosure Number: IPCOM000049450D
Original Publication Date: 1982-Jun-01
Included in the Prior Art Database: 2005-Feb-09

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Acosta, RE Puippe, JC Von Gutfeld, RJ [+details]


In the process of studying the mechanisms that operate during laser enhanced electroplating, we have discovered that it is possible to write patterns by selectively plating or etching of lines on a substrate without electroplating or etching, respectively, the background area metal outside the region of the substrate that is being irradiated by the laser.