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Laser Enhanced Plating/ Etching

IP.com Disclosure Number: IPCOM000049450D
Original Publication Date: 1982-Jun-01
Included in the Prior Art Database: 2005-Feb-09

Publishing Venue

IBM

Related People

Authors:
Acosta, RE Puippe, JC Von Gutfeld, RJ [+details]

Abstract

In the process of studying the mechanisms that operate during laser enhanced electroplating, we have discovered that it is possible to write patterns by selectively plating or etching of lines on a substrate without electroplating or etching, respectively, the background area metal outside the region of the substrate that is being irradiated by the laser.