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Self Aligned Parallel Heat Extraction Arrangement for VLSI Circuits

IP.com Disclosure Number: IPCOM000049458D
Original Publication Date: 1982-Jun-01
Included in the Prior Art Database: 2005-Feb-09

Publishing Venue

IBM

Related People

Authors:
Shapiro, E [+details]

Abstract

This article describes a means for removing heat from an array of modules 2 having very large scale integrated (VLSI) circuits 4 mounted thereon with solder ball connections 6. The array of modules 2 are mounted on a board 8, and has a module cap 10 connected to a first rigid duct wall 12 via a machined plate 14. The first rigid duct wall 12 is connected to a second rigid wall 16 by a plurality of stiffeners 18 and springs 20. A coolant 22 flows between the rigid walls 12 and 16 to extract the heat.