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Extended Pin Heat Sink Disclosure Number: IPCOM000049508D
Original Publication Date: 1982-Jun-01
Included in the Prior Art Database: 2005-Feb-09

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Related People

Colavito, BC Davis, JH King, KR [+details]


The heat-dissipating ability of an electronic module, such as an integrated circuit package, is greatly improved by mounting the module to the printed circuit board with extended pins. The pins are also widened in the direction of air flow to provide a greater surface area for improved dissipation of heat from the pins.