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This system will reduce total test time and minimize failure recovery of modules during functionality and performance tests at elevated temperatures by providing a controlled preheat system.
English (United States)
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Automated Module Preheat Oven
This system will reduce total test time and minimize failure recovery of
modules during functionality and performance tests at elevated temperatures by
providing a controlled preheat system.
It is often necessary to evaluate the functionality and performance of a
module at some temperature above 25 degrees C. In most cases, this is
accomplished by placing the device on a tester and heating it with a thermo
probe over the device. Because of the limited heating capability of the probes,
this process may take 3 to 4 minutes per module (assuming a target temperature
of, for example, 85 degrees C). It is desireable, therefore, to have some sort of
preheating mechanism, so that the thermo probes holding the device will be used
only to maintain the temperature and not raise the unit to the temperature.
Because some types of failures discovered during an elevated-temperature
stress have a tendency to disappear if the device is heated for a prolonged
period. It is necessary to limit the device's exposure to this condition.
The apparatus, shown in the figure, which accomplishes the above result
comprises an oven 10 in which there is located a module holding track 11
maintained at an angle of 45 degrees to the horizontal. This module track is
comprised of an upper level 12 and a lower level 13 to which are fitted hydraulic
rams 14 and 15, respectively. The upper ram 14, which is the initial feed ram, is
aligned to the upper level 12, while ram 15, which is the exit ram, is aligned with
the lower level 13. The module track 11 extends through the oven, with the rams
being located on one side outside of the oven. An exit depot is located on the
opposite end of the track 11. A module feed mechanism 17 is located above...