Browse Prior Art Database

Increased Wiring Area for Standing Pinned Substrates

IP.com Disclosure Number: IPCOM000049554D
Original Publication Date: 1982-Jun-01
Included in the Prior Art Database: 2005-Feb-09

Publishing Venue

IBM

Related People

Authors:
Darrow, RE Funari, J Ingraham, GJ Kotrch, GS [+details]

Abstract

Pins are mechanically fastened by inserting them through a hole in the ceramic substrate and upsetting the pin on the top and bottom of the substrate. The pins are fed into precisely located bushings in a prescribed pin pattern dictated by the holes in the substrates. The pinning equipment is designed so that the substrate locates on the pins. Therefore, if the hole location on the substrate is on the same location as the pins in the bushings, the substrate will fit over the pins. The problem becomes acute when the holes on the substrate vary in reference to the pins located in the bushing block. Forcing the substrates over these pins causes stress in the ceramic which results in its being cracked. The pin head produced on the substrate top surface also reduces the area between the pins.