Browse Prior Art Database

Chip Heat Transfer Structure

IP.com Disclosure Number: IPCOM000049570D
Original Publication Date: 1982-Jun-01
Included in the Prior Art Database: 2005-Feb-09

Publishing Venue

IBM

Related People

Authors:
Hassan, JK Oktay, S Paivanas, JA [+details]

Abstract

The illustrated structures provide a conformable heat transfer structure utilizing a low melting point bismuth alloy solder in combination with an elastomeric material with embedded wires to conduct heat from a chip to a heat sink, and to confine the plastic flow of the solder.