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Chip Heat Transfer Structure Disclosure Number: IPCOM000049570D
Original Publication Date: 1982-Jun-01
Included in the Prior Art Database: 2005-Feb-09

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Related People

Hassan, JK Oktay, S Paivanas, JA [+details]


The illustrated structures provide a conformable heat transfer structure utilizing a low melting point bismuth alloy solder in combination with an elastomeric material with embedded wires to conduct heat from a chip to a heat sink, and to confine the plastic flow of the solder.