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Briefly, this article describes a method for detecting oxygen contamination in a plasma process. The plateability of a thin metallic film serves as a test for the presence of oxygen in a plasma.
English (United States)
This text was extracted from a PDF file.
This is the abbreviated version, containing approximately
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Detection of Oxygen Contamination in a Plasma Process
Briefly, this article describes a method for detecting oxygen contamination in
a plasma process. The plateability of a thin metallic film serves as a test for the
presence of oxygen in a plasma.
In more detail, a non-reactive plasma species (e.g., argon) is often used in
surface-treating device film levels. There is always a risk that the plasma may be
contaminated by oxygen which enters the vacuum chamber through leakage or
gas source contamination.
To test for the presence of oxygen in a plasma, the following
steps may be taken:
1) An oxidation-sensitive metallic thin film is vacuum
deposited on the substrate.
2) One half of the film surface is masked by another substrate
or by a photoresist coating.
3) The partially masked film is subjected to the suspect plasms
4) The partial mask is removed, and the film is subjected to
a low power electroplating cycle. A suitable cycle would
be one which would normally place 1000 angstroms of gold
onto a clean thin metallic film.
5) The thickness of the plated films on the masked and
unmasked regions of the substrate is measured. If the
exposed region was oxidized during the plasma cycle, the
electroplating will be thinner over the exposed region
than over the masked region due to the higher surface
resistivity of the exposed region.
If plasma contamination is suspected but it is not known whether the film is
being contaminated with oxygen or an organic film, th...