Dismiss
The InnovationQ application will be updated on Sunday, May 31st from 10am-noon ET. You may experience brief service interruptions during that time.
Browse Prior Art Database

Process to Join JEDEC Chip Carriers to MLC

IP.com Disclosure Number: IPCOM000049610D
Original Publication Date: 1982-Jun-01
Included in the Prior Art Database: 2005-Feb-09

Publishing Venue

IBM

Related People

Authors:
DeBoskey, WR Gandy, FD Lanpher, DA Laurent, C Privette, RA Sullivan, JF [+details]

Abstract

This article describes techniques for joining chip carriers to multilayer ceramic (MLC) substrates and for reworking such chip carriers. Briefly, the technique for joining the chip carriers to the substrate uses a two-step paste deposition process and a double reflow step process at higher than conventional temperatures. The rework techniques include the use of an aluminum block to provide localized heating prior to removal of a defective carrier and the step of screening solder paste onto the bottom of new chip carriers under certain conditions instead of onto the substrate.