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Laser Fused Thick Film Circuit Printing

IP.com Disclosure Number: IPCOM000049632D
Original Publication Date: 1982-Jul-01
Included in the Prior Art Database: 2005-Feb-09

Publishing Venue

IBM

Related People

Authors:
Keen, RG [+details]

Abstract

Thick film circuit printing is accomplished by laser fusing dry powder solids to a substrate, without the use of a binder material with the powder solids. During printing the powder solids are held in place on the substrate by an electrostatic field, which is maintained while the desired pattern is fused by laser onto the substrate. After fusing, the electrical charge is neutralized, allowing the excess powder to drop away in its unchanged form for reuse.