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Ethylene Diamine as an Adhesion Promoter between Cured Polymide Layers

IP.com Disclosure Number: IPCOM000049670D
Original Publication Date: 1982-Jul-01
Included in the Prior Art Database: 2005-Feb-09

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Linde, H Rausch, H [+details]


In the manufacturing of semiconductors and substrates for mounting semiconductors it is often necessary to apply two superimposed layers of polyimide. In the past, problems have been encountered in obtaining good adhesion between the two layers. The present technique provides two superimposed layers of polyimide having excellent adhesion properties one to the other.