Browse Prior Art Database

Insuring the Hermeticity of Chip Packages

IP.com Disclosure Number: IPCOM000049682D
Original Publication Date: 1982-Jul-01
Included in the Prior Art Database: 2005-Feb-09

Publishing Venue

IBM

Related People

Authors:
Franchak, NP Ingraham, AP Rivenburgh, DL Terney, ST [+details]

Abstract

Available chip packages generally consist of a ceramic chip carrier with a lid which contains a chip that is hermetically sealed using a low melt gold/tin solder. Attachment to MC (metallized ceramic) substrates requires a higher melting solder which causes melting of the gold/tin solder during processing. This can cause movement of the lid and subsequent loss of hermeticity.