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Post Treatment of Circuitized MCP

IP.com Disclosure Number: IPCOM000049689D
Original Publication Date: 1982-Jul-01
Included in the Prior Art Database: 2005-Feb-09

Publishing Venue

IBM

Related People

Authors:
Efros, AA Snyder, KA [+details]

Abstract

This post treatment mitigates and/or eliminates electrical leakage acquired on an organic, i.e., polyimide, film during the sputter cleaning of the vias in the film and/or the sputtering of successive metal layers on the film.