Browse Prior Art Database

Laminated Metal Core Circuit Card with Controlled Thermal Expansivity

IP.com Disclosure Number: IPCOM000049735D
Original Publication Date: 1982-Jul-01
Included in the Prior Art Database: 2005-Feb-09

Publishing Venue

IBM

Related People

Authors:
Aakalu, NG Barthel, GM Carlen, RA [+details]

Abstract

This method of packaging is designed to permit mounting of large scale integration chips directly onto a "printed" wiring carrier. It also allows screened-on resistors and modules on the same carrier.