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Laminated Metal Core Circuit Card with Controlled Thermal Expansivity Disclosure Number: IPCOM000049735D
Original Publication Date: 1982-Jul-01
Included in the Prior Art Database: 2005-Feb-09

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Related People

Aakalu, NG Barthel, GM Carlen, RA [+details]


This method of packaging is designed to permit mounting of large scale integration chips directly onto a "printed" wiring carrier. It also allows screened-on resistors and modules on the same carrier.