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Tri-Metal Pedestal Forming and Placement Mechanism

IP.com Disclosure Number: IPCOM000049863D
Original Publication Date: 1982-Aug-01
Included in the Prior Art Database: 2005-Feb-09

Publishing Venue

IBM

Related People

Authors:
Phelps, DW Ward, WC [+details]

Abstract

In the manufacture of substrates for accommodating both flip chip type bonding and wire bonding of chips, small pads of a tri-layer solder nickel aluminum metal are required, which are bonded to selected metal pads on the substrate. The tri-metal pads are typically arrayed in a rectangular pattern on the substrate surrounding a site for the locating of a chip which will be wire bonded for the pads. The device in this article cuts the required configuration and number of pads from a strip of material and locates the cut pieces on a substrate.