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This method determines time above liquidus of solder balls for attaching monolithic circuit chips to a ceramic substrate in circuit modules.
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Process Monitor for Determining Time Above Liquidus
This method determines time above liquidus of solder balls for attaching
monolithic circuit chips to a ceramic substrate in circuit modules.
A solid unmelted solder ball will have different ultrasonic absorption
characteristics than a liquid solder ball. By monitoring the ultrasonic
characteristics of a circuit module in a chip join furnace, one can measure time
If an alternating voltage from an oscillator is applied across two adjacent,
internal lands in a circuit module with a ceramic substrate, an ultrasonic signal
will result. This is because the ceramic substrate will act as an ultrasonic
transmitter between the lands. Furthermore, if a voltage monitor is hooked up to
two adjacent lands in the module, the combination of the lands and the ceramic
substrate will act as an ultrasonic receiver. Thus, the ultrasonic characteristics of
the module can be monitored as it passes through the furnace using the
ultrasonic characteristics of the ceramic substrate.