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Printed Circuit Module Assembly

IP.com Disclosure Number: IPCOM000050059D
Original Publication Date: 1982-Sep-01
Included in the Prior Art Database: 2005-Feb-10

Publishing Venue

IBM

Related People

Authors:
Kilburn, RF Olsen, RF [+details]

Abstract

The figure shows, in longitudinal section, an improved printed circuit module assembly. The assembly includes a ceramic substrate 10, on which is mounted an I/C chip 12 by means of C-4 solder connections 14.