The InnovationQ application will be updated on Sunday, May 31st from 10am-noon ET. You may experience brief service interruptions during that time.
Browse Prior Art Database

Printed Circuit Module Assembly

IP.com Disclosure Number: IPCOM000050059D
Original Publication Date: 1982-Sep-01
Included in the Prior Art Database: 2005-Feb-10

Publishing Venue


Related People

Kilburn, RF Olsen, RF [+details]


The figure shows, in longitudinal section, an improved printed circuit module assembly. The assembly includes a ceramic substrate 10, on which is mounted an I/C chip 12 by means of C-4 solder connections 14.