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Adhesive Metal Shim Module Capping Technique

IP.com Disclosure Number: IPCOM000050081D
Original Publication Date: 1982-Sep-01
Included in the Prior Art Database: 2005-Feb-10

Publishing Venue

IBM

Related People

Authors:
Dunn, RM Moore, RJ Timko, N [+details]

Abstract

This arrangement provides a means of capping (temporarily or otherwise) single or multi-chip modules in such a way as to render the caps easily removable and the remaining adhesive residue readily cleanable.