Dismiss
The InnovationQ application will be updated on Sunday, May 31st from 10am-noon ET. You may experience brief service interruptions during that time.
Browse Prior Art Database

Pretreatment of Peel a Part Copper

IP.com Disclosure Number: IPCOM000050083D
Original Publication Date: 1982-Sep-01
Included in the Prior Art Database: 2005-Feb-10

Publishing Venue

IBM

Related People

Authors:
Wiley, RT [+details]

Abstract

Commercially available peel a part copper can be used to fabricate printed circuit boards. Improved quality can be achieved by pretreating the peel a part copper in a sodium persulfate bath. This bath is applied after the peel a part copper layer is laminated to the substrate and the carrier has been removed. The treatment consists of 30-90 seconds in a room temperature bath which has 2 pounds per gallon of sodium persulfate and 2 percent sulfuric acid.