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The individual bond or contact force of additive plated blind vias may be determined by the process described below.
English (United States)
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Individual Blind Via Testing
The individual bond or contact force of additive plated blind vias may be
determined by the process described below.
An individual blind via in a test site on a printed circuit board is selected, and
the board is cut with a scalpel to circumscribe the test portion. The scalpel is
also used to cut the glass fibers between the individual blind vias in a cross-hatch
pattern. Using a soldering iron tip of appropriate diameter heated to 315 degrees
C, the tip is soldered to the top copper of the blind via. When the solder is
solidified (280 degrees C) but while the epoxy is still molten, the test via is pulled
from the board by withdrawing the solder tip. The solder tip with the attached via
is then placed in a tensile tester, with the other end of the via gripped by a
suitable clamp. The tensile force is then increased until the via elements
separate and the tensile response is measured and recorded.