Reduction of Collector Emitter Leakage by Ion Implantation of Sub Collectors
Original Publication Date: 1982-Sep-01
Included in the Prior Art Database: 2005-Feb-10
High doses of arsenic must be deposited in subcollector regions to ensure low resistivity and proper device performance. Capsule processing of subcollectors requires very high (approximately 2.5 x 10/16/ /cm/2/) nominal doses of arsenic in order to maintain distribution tails of resistivity within device specifications. These very high doses lead to clustering of inactive arsenic near the surface of subcollector regions and interfere with epitaxial growth of silicon over these regions. These epitaxial defects result in collector emitter leakage paths and impact device yields.