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Method of Eliminating Aluminum Chloride Formation in an Aluminum Plasma Etcher

IP.com Disclosure Number: IPCOM000050111D
Original Publication Date: 1982-Sep-01
Included in the Prior Art Database: 2005-Feb-10

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Bondur, JA Kaplita, GA Ma, WH Makris, JS [+details]


The use of TEFLON* tape on the aluminum cathode of a reactive ion etching chamber eliminates unwanted formation of aluminum chloride on the etch sample anode.