Browse Prior Art Database

Polishing Slurries with Varied Particle Size

IP.com Disclosure Number: IPCOM000050112D
Original Publication Date: 1982-Sep-01
Included in the Prior Art Database: 2005-Feb-10

Publishing Venue

IBM

Related People

Authors:
Kaplan, P Mendel, E [+details]

Abstract

This method for formulating silicon chemical mechanical polishing slurries entails the use of bimodal particle size distributions to provide faster stock removal rates.