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Thick Film Termination of Low Inductance Ceramic Chip Capacitors

IP.com Disclosure Number: IPCOM000050115D
Original Publication Date: 1982-Sep-01
Included in the Prior Art Database: 2005-Feb-10

Publishing Venue

IBM

Related People

Authors:
Humenik, JN Tummala, RR [+details]

Abstract

Low inductance ceramic chip capacitors (tab capacitors) have been proposed for use as a decoupling capacitor on substrates (Fig. 1). The low inductance of such a capacitor is derived from the multiple tab leads to each internal plate, the shorting bars tying together tabs of a similar voltage, and the multiple solder ball interconnections between the capacitor and the substrate.