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Precision Artwork by Contact Printing and Masking

IP.com Disclosure Number: IPCOM000050136D
Original Publication Date: 1982-Sep-01
Included in the Prior Art Database: 2005-Feb-10

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Edwards, JC [+details]


A major problem in creating bumped automated beam tape for bonding to n an integrated circuit chip is the precision required to generate multiple photomasks for the etching of the bumps. This is achieved by generating a single, high resolution photomask of the beam lead layout, making a contact exposure (emulsion side to emulsion side) of that master, and then re-exposing all but the tips of the beam leads using a lower resolution photomask.