Precision Artwork by Contact Printing and Masking
Original Publication Date: 1982-Sep-01
Included in the Prior Art Database: 2005-Feb-10
A major problem in creating bumped automated beam tape for bonding to n an integrated circuit chip is the precision required to generate multiple photomasks for the etching of the bumps. This is achieved by generating a single, high resolution photomask of the beam lead layout, making a contact exposure (emulsion side to emulsion side) of that master, and then re-exposing all but the tips of the beam leads using a lower resolution photomask.