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High Speed Transfer of Conductors for Field Assisted Bonding to Glass Plates

IP.com Disclosure Number: IPCOM000050204D
Original Publication Date: 1982-Sep-01
Included in the Prior Art Database: 2005-Feb-10

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Horstmann, RE [+details]


Field-assisted bonding (FAB) of wires (a1) on the order of .02 mm diameter to glass plates, such as plate 10 in Fig. 1, which requires transfer of the wire from a drum, such as drum 11 in Fig. 1. or from a plate onto a glass panel, such as plate 10, has been unsatisfactory in the past due to the wandering of the wires during the process of transfer.