Functional Speed Testing on a Nodal Impedance Tester
Original Publication Date: 1982-Sep-01
Included in the Prior Art Database: 2005-Feb-10
The card assembly being tested 1 is placed onto the backup plate 2 and positioned under a probehead 3 containing a bed of nails 4. When testing is activated, the locking detent 5 locks the backup plate 2 in position and the probehead 3 moves down so that the bed of nails 4 contacts nodes on the card assembly being tested 1. Pressure from the downward movement of the probehead assembly mates a row of male test points 6 to a receiver 7 fastened to the backup plate 2 and connected by a short wire harness 8 to micro intelligence 9, also a portion of the backup plate 2. Hardware variations on the mating of the card assembly under test 1 to the backup plate intelligence 9 are expected to exist.