The InnovationQ application will be updated on Sunday, May 31st from 10am-noon ET. You may experience brief service interruptions during that time.
Browse Prior Art Database

Hybrid Formed Metal Layer for MCP Substrate

IP.com Disclosure Number: IPCOM000050279D
Original Publication Date: 1982-Oct-01
Included in the Prior Art Database: 2005-Feb-10

Publishing Venue


Related People

Abolafia, OR Peter, AE [+details]


A metal layer of a multilayer metallization structure is formed as a hybrid consisting of a first part formed by sputtering and a second part formed by evaporation of the remainder of the layer on the first part.