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Hybrid Formed Metal Layer for MCP Substrate

IP.com Disclosure Number: IPCOM000050279D
Original Publication Date: 1982-Oct-01
Included in the Prior Art Database: 2005-Feb-10

Publishing Venue

IBM

Related People

Authors:
Abolafia, OR Peter, AE [+details]

Abstract

A metal layer of a multilayer metallization structure is formed as a hybrid consisting of a first part formed by sputtering and a second part formed by evaporation of the remainder of the layer on the first part.