Aluminum and Aluminum Alloy Source for Computer Controlled E-Beam Deposition
Original Publication Date: 1982-Oct-01
Included in the Prior Art Database: 2005-Feb-10
This article relates to improved aluminum and aluminum alloy sources, such as Al-Cu, to be used in computer-controlled E-beam thin film deposition. Inadvertently, these sources are often received having a thick oxide coating (to about 1600 Angstroms). Due to this oxide layer the sources will not melt under normal deposition conditions. Since parameters, such as electron-beam current, are continually monitored and controlled within a specific range to prevent source spitting, etc., this current cannot be increased to penetrate the oxide surface.