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Aluminum and Aluminum Alloy Source for Computer Controlled E-Beam Deposition

IP.com Disclosure Number: IPCOM000050289D
Original Publication Date: 1982-Oct-01
Included in the Prior Art Database: 2005-Feb-10

Publishing Venue

IBM

Related People

Authors:
Emmons, DF Flachbart, RH McCullogh, KJ Schnitzel, RH [+details]

Abstract

This article relates to improved aluminum and aluminum alloy sources, such as Al-Cu, to be used in computer-controlled E-beam thin film deposition. Inadvertently, these sources are often received having a thick oxide coating (to about 1600 Angstroms). Due to this oxide layer the sources will not melt under normal deposition conditions. Since parameters, such as electron-beam current, are continually monitored and controlled within a specific range to prevent source spitting, etc., this current cannot be increased to penetrate the oxide surface.