System for Controlling Saw Blade Excursions During the Slicing of Silicon Crystals
Original Publication Date: 1982-Oct-01
Included in the Prior Art Database: 2005-Feb-10
This article describes a system for monitoring and automatically correcting deviations from a desired path of a slicing blade used to cut silicon wafers from an ingot, which deviations result in bowing and warpage of the wafers cut. The system features a blade deviation detector and eads responsive to the detector for correcting the deviation by the introduction of a compensating fluid at the blade edge.