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System for Controlling Saw Blade Excursions During the Slicing of Silicon Crystals Disclosure Number: IPCOM000050293D
Original Publication Date: 1982-Oct-01
Included in the Prior Art Database: 2005-Feb-10

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Related People

Carufe, PR Guggenheim, RC White, WH Pace, JC [+details]


This article describes a system for monitoring and automatically correcting deviations from a desired path of a slicing blade used to cut silicon wafers from an ingot, which deviations result in bowing and warpage of the wafers cut. The system features a blade deviation detector and eads responsive to the detector for correcting the deviation by the introduction of a compensating fluid at the blade edge.