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Josephson Packaging Technique

IP.com Disclosure Number: IPCOM000050419D
Original Publication Date: 1982-Oct-01
Included in the Prior Art Database: 2005-Feb-10

Publishing Venue

IBM

Related People

Authors:
Chang, WH [+details]

Abstract

In Josephson technology, a package is known wherein Josephson circuit boards are arranged perpendicularly to a horizontal board carrying a ground plane. The circuit board contains Josephson device circuits, a ground plane, and a signal line. In this package, the gaps between the vertical boards and the horizontal board introduce inductance discontinuities which limit the speed of the Josephson circuits. In order to overcome this, V-grooves several mils deep are etched in the top surface of the horizontal board, and the vertical circuit boards are bonded to these V-grooves. This results in a structure in which the vertical circuit boards are arranged at an angle less than 90 degrees to the horizontal board.