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Silicon Alignment Frame for Spherical Standoff Placement

IP.com Disclosure Number: IPCOM000050420D
Original Publication Date: 1982-Oct-01
Included in the Prior Art Database: 2005-Feb-10

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Related People

Bickford, HR Palmer, MJ [+details]


In microcircuits, such as circuits using Josephson devices, it is often necessary to provide accurate and repeatable placement of metal spheres onto solder I/O pads. These metal spheres can be used for electrical connections between the demountable cables and adapters and for chip-test adapter connections. To provide improved alignment of the metal spheres with the solder I/O pads, a silicon alignment frame is used having an array of hour-glass shaped holes therein.