Browse Prior Art Database

Package for Memory Arrays

IP.com Disclosure Number: IPCOM000050502D
Original Publication Date: 1982-Nov-01
Included in the Prior Art Database: 2005-Feb-10

Publishing Venue

IBM

Related People

Authors:
Balderes, D White, ML [+details]

Abstract

High density, high power logic modules requiring liquid cooling are mounted in a planar board arrangement. On the same planar board, air-cooled, high density memory chip carriers are mounted, and interconnected to the logic via the same planar board. This allows for a short communication distance to main memory.