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Weld/ Braze Circuit Path Encapsulation and Corrosion/ Migration Barrier

IP.com Disclosure Number: IPCOM000050634D
Original Publication Date: 1982-Nov-01
Included in the Prior Art Database: 2005-Feb-10

Publishing Venue

IBM

Related People

Authors:
Phelps, DW Samuelsen, SJ Ward, WC [+details]

Abstract

In certain types of ceramic substrates for mounting integrated circuit chips, it is necessary to join copper pins to refractory metal pads on the substrate. One desirable technique is by the use of copper/silver brazing alloy to form the connection. However, silver and silver alloys are very prone to corrosion and migration if exposed to the atmosphere.