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Method and Apparatus for Curing Coated Substrates

IP.com Disclosure Number: IPCOM000050640D
Original Publication Date: 1982-Nov-01
Included in the Prior Art Database: 2005-Feb-10

Publishing Venue

IBM

Related People

Authors:
Lowen, AM Palchik, SS [+details]

Abstract

In the formation of metallized substrates for packaging I/C chips, one technique employs an insulating layer of polyimide as part of the multilayered circuitry of the substrate. After the application of a liquid polyamic acid coating, several heating steps are employed to cure the acid into a solid polyimide dielectric coating. The present apparatus and method provides a controlled heat during the second heating step, commonly referred to as the intermediate cure, without removing the substrates from etch racks.