Thermal Photovoltage Decay
Original Publication Date: 1982-Nov-01
Included in the Prior Art Database: 2005-Feb-10
A method of determining trapping centers or metallic contaminants in semiconductor wafers is provided which is rapid and non-destructive. The method determines trapping centers or metallic contaminants in, e.g., silicon wafers with a PN junction by the thermal behavior of open-circuit photovoltage decay through non-contact inductive or capacitive sensing techniques and is an alternative to the methods disclosed in (1, 2).