Test to Control Wafer Sensitivity to Defect Propagation
Original Publication Date: 1982-Dec-01
Included in the Prior Art Database: 2005-Feb-10
The purpose of the test described herein is to control wafer sensitivity to defect propagation in order to improve wafer quality and then to increase semiconductor yields. The test consists of two heat treatment steps and a final revelation of the defects in a Wright-Etch solution.