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Non-Corrosive, Water Soluble Flux for Flip Chip Soldering

IP.com Disclosure Number: IPCOM000050653D
Original Publication Date: 1982-Dec-01
Included in the Prior Art Database: 2005-Feb-10

Publishing Venue

IBM

Related People

Authors:
Antoune, B [+details]

Abstract

Flip-chip techniques are widely used for mounting semiconductor chips onto ceramic modules.