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Electrical Contacting Method

IP.com Disclosure Number: IPCOM000050661D
Original Publication Date: 1982-Dec-01
Included in the Prior Art Database: 2005-Feb-10

Publishing Venue

IBM

Related People

Authors:
Schneider, J [+details]

Abstract

The described method serves to electrically contact lines 1 on circuit cards 2 and contact pins 3. Using screen printing and vacuum impregnating processes, liquid epoxy 4, in which metal particles 5 are suspended, is filled into via holes 6. Then pins 3 are inserted, and the liquid epoxy 4 is cured in an oven. This ensures satisfactory, high-strength bonding of circuit cards 2 and pins 3 and electrical contact between the lines to be connected and pins 3 as a result of the embedded metal particles 5.