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Substrate Wiring Pattern for Partial Good Integrated Circuit Chips

IP.com Disclosure Number: IPCOM000050698D
Original Publication Date: 1982-Dec-01
Included in the Prior Art Database: 2005-Feb-10

Publishing Venue

IBM

Related People

Authors:
Bartley, GK Johnson, CL [+details]

Abstract

Integrated-circuit (IC) chips having redundant bits are connected to substrate pads by a wiring pattern such that any bad bit may be isolated by a simple trace-cutting operation during packaging.