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Selective Activation of Metal Salt Loaded Polyimide by Exposure to Plasma

IP.com Disclosure Number: IPCOM000050747D
Original Publication Date: 1982-Dec-01
Included in the Prior Art Database: 2005-Feb-10

Publishing Venue

IBM

Related People

Authors:
Romankiw, LT [+details]

Abstract

In the past, polyimide containing metal salt particles was deposited upon a substrate by spinning a solution of a polar solvent, polyimide and a metallic salt upon the substrate. Then a photoresist mask stencil was formed upon the polyimide film produced. Next, the structure was heated to remove some of the polyimide. Finally, the structure was dipped into an electroless bath. The process was slowed by the reduction of the salt particles by the reducing agent in the electroless plating bath. Here, plasma etching is used to remove the outer surface of polyimide and simultaneously reduce the metal salts to yield an immediate plating base for an electrolessly deposited metallic layer.