Browse Prior Art Database

Chip Mounting Using Mercury Tension Bands and Alignment Frames

IP.com Disclosure Number: IPCOM000050758D
Original Publication Date: 1982-Dec-01
Included in the Prior Art Database: 2005-Feb-10

Publishing Venue

IBM

Related People

Authors:
Brown, KH Van der Hoeven, BJ [+details]

Abstract

Microminiaturized alignment frames of solder or polyamide provide lateral retention for chips during periods when liquid metal bonds are in the liquid phase, when only surface tension bonds and the retention frames hold the chips in place.