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Chip Mounting Using Mercury Tension Bands and Alignment Frames Disclosure Number: IPCOM000050758D
Original Publication Date: 1982-Dec-01
Included in the Prior Art Database: 2005-Feb-10

Publishing Venue


Related People

Brown, KH Van der Hoeven, BJ [+details]


Microminiaturized alignment frames of solder or polyamide provide lateral retention for chips during periods when liquid metal bonds are in the liquid phase, when only surface tension bonds and the retention frames hold the chips in place.