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Epoxy Resin with High Glass Transition

IP.com Disclosure Number: IPCOM000050811D
Original Publication Date: 1982-Dec-01
Included in the Prior Art Database: 2005-Feb-10

Publishing Venue

IBM

Related People

Authors:
Chellis, LN Christie, FR Daley, LR [+details]

Abstract

A tetraglycidyl methylenedianiline resin can be combined with a multifunctional cresol hardener and a highly brominated epoxy resin in a low boiling point solvent. A printed circuit board having a high (approx. 180 degrees C) glass transition temperature and flame retardant properties can be formed by impregnating glass cloth with this material.