Dismiss
The InnovationQ application will be updated on Sunday, May 31st from 10am-noon ET. You may experience brief service interruptions during that time.
Browse Prior Art Database

Gold Plated Nickel Pins for Thermal Conduction Module

IP.com Disclosure Number: IPCOM000050867D
Original Publication Date: 1982-Dec-01
Included in the Prior Art Database: 2005-Feb-10

Publishing Venue

IBM

Related People

Authors:
DiGiacomo, G Prasad, C [+details]

Abstract

An alloy consisting of 99.50 per cent Ni, .10 - .15 per cent Cu, .15 - .20 per cent Fe, .15- .20 per cent Si, .005 - .007 S, and .05 - .1 per cent C has optimum physical, mechanical and metallurgical properties for pin application. The alloy avoids the problem of braze reaction with KOVAR(Trademark of Westinghouse Electric Corporation.) pins (which leads to weak joints), assures uniformity of joint strength, improves thermal conductivity, eliminates the need for plating KOVAR pins with Ni or Pd, and solves the problem of contact resistance due to Fe diffusion.