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Solder Reflow Using Conduction Heating

IP.com Disclosure Number: IPCOM000050957D
Original Publication Date: 1982-Dec-01
Included in the Prior Art Database: 2005-Feb-10

Publishing Venue

IBM

Related People

Authors:
Antonetti, VW Gupta, OR Scarafino, AJ Torino, AL [+details]

Abstract

A variety of methods have been used to solder connector contacts to circuit cards. For example, microflame heating and hot air impinging techniques have been utilized but have been found to be very time-consuming.