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Zero Insertion Force Electrical Connector with Contact Wipe Action

IP.com Disclosure Number: IPCOM000050966D
Original Publication Date: 1982-Dec-01
Included in the Prior Art Database: 2005-Feb-10

Publishing Venue

IBM

Related People

Authors:
Bauman, AH Bourke, DG [+details]

Abstract

In a cut-away isometric view, Fig. 1 illustrates a high density connector arrangement for connecting conductive pads on LSI cards to corresponding pads on inter-card connection boards. In addition to high connection densities, this arrangement provides other desirable connection characteristics such as contact wiping action, dust tightness, good retention, zero insertion force and economical manufacture.