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Thermal Compound for Semiconductor Packages

IP.com Disclosure Number: IPCOM000051030D
Original Publication Date: 1982-Dec-01
Included in the Prior Art Database: 2005-Feb-10

Publishing Venue

IBM

Related People

Authors:
Mondou, ER Young, SP [+details]

Abstract

The operation of highly integrated semiconductor devices generates a significant amount of heat which must be dissipated. This heat is conventionally dissipated by either backbonding the device to a suitable substrate and making some suitable cooling provision for the substrate, or, in the instance of flip-chip bonded devices, removing heat from the backside of the device with cooling pistons or other means that serve as a heat conduction bridge to fins or a cooling sink. A structure that can be used for cooling a device 10, solder bonded to substrate 12, is a layer of thermal grease 14 located between device 10 and finned cap 16.