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Heat Transfer Compound Disclosure Number: IPCOM000051031D
Original Publication Date: 1982-Dec-01
Included in the Prior Art Database: 2005-Feb-10

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Mondou, ER Young, SP [+details]


This compound is useful when placed between the backside of an integrated circuit device mounted on a substrate and the cap or heat sink. The compound significantly reduces the thermal resistance between the device and the cap or heat sink, thereby promoting better and more effective cooling of the semiconductor device.