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Reliability Enhancement of MCP Vias Using Nickel

IP.com Disclosure Number: IPCOM000051064D
Original Publication Date: 1982-Aug-01
Included in the Prior Art Database: 2005-Feb-10

Publishing Venue

IBM

Related People

Authors:
Getten, JR Nair, KK Snyder, KA [+details]

Abstract

The present metallurgy used in the metallized ceramic polyimide (MCP) process involves the evaporation of an M1 layer of Cr Cu Cr onto a substrate and then applying a layer of polyimide. Via holes are then etched which extend down to the M1 Cu. Then an M2 layer of Cr Cu Cr is evaporated onto the polyimide and via holes, This metallurgy has been found to lend itself to a via resistance problem, mainly because Cr and Cu, which form the interface, are not mutually soluble metals.